MACOM – Partners from RF to Light – (Nasdaq:AMCC), a global leader in computing and connectivity solutions, and Theobroma Systems today announced a COMExpress module featuring AppliedMicro’s HeliX 2 SoC (System on a Chip) designed specifically for industrial applications. This joint effort builds upon almost three years of close collaboration between the two companies, with Theobroma Systems supporting AppliedMicro with software engineering expertise and performance tuning for ARMv8 on its X-Gene® platforms.

We have had the privilege to experience, first-hand, the evolution of the X-Gene architecture from FPGA-based verification boards to a market-proven processor for data-centers, network-appliances, and cloud computing,” said Dr. Philipp Tomsich, Chief Technology Officer for Theobroma Systems. “With the optimized HeliX 2 processor, we have the unique opportunity to extend the benefits of the X-Gene family into the application domain that our company has focused on since its inception: networked, embedded applications.

The COMExpress SoM (System on Module) features the HeliX2 processor with SO-DIMM slots for flexible ECC-enabled memory configurations using industry-standard memory modules. On-module flash storage provides for a module bootable without any external peripherals and ensures reliable storage for embedded operating systems, customer applications and user data. An enhanced COMExpress pin-out makes the full capabilities of the HeliX 2 processor, including one of its 10 Gigabit Ethernet interfaces, available to compatible baseboards.

AppliedMicro’s Helix 2 processor architecture allows us to further build on our momentum bringing 64-bit ARM technology to a broad range of embedded markets,” said John Williams, AppliedMicro VP of Marketing. “Theobroma Systems has been an ideal partner to collaborate with on this module as we extend our access to developers in the networking, storage, industrial automation, and imaging markets.”

A customized baseboard complements the COMExpress module to form a complete evaluation platform and enables a quick-start for developers adopting the HeliX 2 processor solution:
10 Gigabit Ethernet and 1 Gigabit Ethernet network interfaces

  • PCI Express® Gen 3 expansion
  • SATA 3 for enterprise-grade mass storage connectivity
  • USB 3.0 for connecting standard peripherals
  • Slot for an ‘intelligent HMI module’ with HDMI® and dual-channel LVDS for visual computing
  • Embedded interfaces (UART, SPI, I2C, SD, GPIO) for quick prototyping

The design documentation of the newly announced product will be made available as a reference design to AppliedMicro’s customers through An evaluation kit featuring a COMExpress module, baseboard, and an ‘intelligent HMI module’ will be available through AppliedMicro’s distribution channels. COMExpress modules for production use will be available directly from Theobroma Systems and through channel partners.

About Theobroma Systems

Theobroma Systems is a leading provider of intelligent devices that integrate embedded systems solutions for industrial and high-assurance applications. Theobroma Systems provides engineering services and Turnkey System-on-Module designs, accelerating time-to-market and lowering project risk for customers. The company is located in Vienna, Austria.

About AppliedMicro

Applied Micro Circuits Corporation (Nasdaq:AMCC) is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Sunnyvale, California.

(C) Copyright 2015 Applied Micro Circuits Corporation, AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are trademarks or registered trademarks of Applied Micro Circuits Corporation. All other products or service names are the property of their respective owners.

Media Contact
Applied Micro Circuits Corporation
Mike Major
Phone: (408) 542-8831

Theobroma Systems GmbH
Makeljana Shkurti
Phone: +43 1 2369893-304